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New & Improved - Dyna-Purge "C"

DYNA-PURGE C is a clear, non-abrasive, non-chemical engineered thermoplastic purging compound, formulated to purge high clarity resins such as PET, GPPS, PC, SAN and PMMA. An additive expands allowing for the purge to reach and clean all areas of the machine. The carrier matrix will then flush away the previous resin and other soils, which eliminate any "milky drag".

Excellent for transition between clear or transparent resins, preventative maintenance, and is excellent for purging through hot runner systems, dies, or other downstream equipments.

Dyna-Purge C is effective through a wide temperature band 193°C-310°C (380°F-590°F) 

Very easy to use: no process adjustment necessary use at the resident resin processing temperature and RPM speed Non-abrasive thermoplastic, which thoroughly loosens carbonized and degraded resin, allowing it to be flushed out of the system 

• Safe, non-hazardous, with no chemicals 
• Ingredients are FDA compliant
• REACH and RoHS compliant
• Heat stable 
• Recommended during shutdown and start-up
• Low "cost-per-purge" — only small quantity needed to be effective
• No mixing required — simply use "as is"
• Unlimited shelf life

Dyna-Purge has been the top performing purging compound for over 30 years! Our product line offers superior cleaning and economic value over other in-house methods and other commercial purging compounds.

Techspan invite you to sample the new Dyna-Purge "C" at no charge, so you can see the results yourself. 

Want to try a 'free sample' ? contact us here.

Dyna-Purge C technical data
Dyna-Purge C case study
Order Dyna-Purge C online